The Cooler Master IceFusion 200g (RG-ICFN-200G-B1) is
a high-capacity, system-builder-value thermal paste package containing roughly enough white silicone-based compound for up to 500 processor applications. It features low thermal resistance, high thermal stability at high temperatures, and non-corrosive properties.
Key Specifications
- Model Number: RG-ICFN-200G-B1
- Net Weight: 200 grams (0.44 lbs)
- Color: White
- Thermal Conductivity: >1.22 W/m-K
- Specific Gravity: >2.5 @ 25°C
- Temperature Stability: -50°C to 240°C
- Application Count: Approx. 500 uses
- Value Size: Designed for repair shops, system builders, and heavy enthusiasts who require large quantities.
- Resealable Container: Prevents the paste from drying out or degrading in storage.
- Safe Compound: Non-corrosive and electrically stable formula safe for standard CPU and GPU applications.
- View system builder details on PCPartPicker.
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